1. The metal pitch targeted (36nm) requires Self-Aligned Quad Patterning (SAQP) apparently is very very hard to do without EUV. TSMC is doing 40nm metal pitch and Samsung does 36nm BUT both of them are using EUV.
I remember them developing an EUV lithography rig at the ALS 11 bend magnet in the 90s... guess it never worked out. Looking at the website: dude's still there!
1. The metal pitch targeted (36nm) requires Self-Aligned Quad Patterning (SAQP) apparently is very very hard to do without EUV. TSMC is doing 40nm metal pitch and Samsung does 36nm BUT both of them are using EUV.
2. Cobalt https://fuse.wikichip.org/news/525/iedm-2017-isscc-2018-inte...
3. COAG https://www.reddit.com/r/AMD_Stock/comments/dk2pw7/why_it_is...